Non-product patterned particle test wafer and testing method the

Details Non-product patterned particle test wafer and testing method the Non-product patterned particle test wafer and testing method the

1995-06-06

1998-01-27

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566571, H01L 2100

Patent

active

057118485

ABSTRACT:
A method for testing a semiconductor wafer processing step. An overlying electrical structure is created on a bare wafer to form a test wafer which simulates the surface contours of production wafers that will be exposed to the tested processing step. The overlying electrical structure of the test wafer is created using the same processing steps are used in manufacturing the overlying electrical structures of production wafers. Although the test wafers have the same surface contour as the production wafers they simulate, the test wafers are less expensive to manufacture because the test wafers do not include any underlying layers found in the production wafers which are not exposed during the tested processing step, and therefore the steps which form these layers can be omitted when making test wafers.

REFERENCES:
patent: 4863548 (1989-09-01), Lee

Affiliated with

Also associated with

Rating

Non-product patterned particle test wafer and testing method the does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Non-product patterned particle test wafer and testing method the, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Non-product patterned particle test wafer and testing method the will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-339006