Non-planar magnet tracking during magnetron sputtering

Details Non-planar magnet tracking during magnetron sputtering Non-planar magnet tracking during magnetron sputtering

1996-07-19

1999-01-05

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429812, 20429818, 20429819, 2042982, C23C 1435

Patent

active

058557440

ABSTRACT:
The structure and method which improves the film thickness uniformity or thickness control when using magnetron sputtering by adjusting the distance between the magnetron or a portion of the magnetron and the sputtering target to provide an improvement in the film thickness uniformity. Shimmed rails, contoured rails, contoured surfaces, cam plates, and cam plate control followers are utilized to achieve an improvement in film thickness uniformity or thickness control due to anomalies in magnetic field as a magnetron assembly moves back and forth when sputtering substrates (utilized primarily for rectangularly shaped substrates).

REFERENCES:
patent: 5262030 (1993-11-01), Potter
patent: 5328585 (1994-07-01), Stevenson et al.
patent: 5382344 (1995-01-01), Hosokawa et al.

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