Non-destructive test for inner lead bond of a tab device

Details Non-destructive test for inner lead bond of a tab device Non-destructive test for inner lead bond of a tab device

1992-03-31

1995-04-18

Cuchlinski, Jr., William A.

Thermal measuring and testing

Leak or flaw detection

With heating or cooling of specimen for test

374 45, 228104, 228105, G01N 2572, G01R 3104

Patent

active

054072751

ABSTRACT:
A method for testing a lead connection to an integrated circuit chip is disclosed. The method comprises the steps of: (a) applying heat to an exposed surface of the integrated circuit chip; and (b) determining the heat transferred from the integrated circuit chip to a lead. Rapid transfer of heat to the lead indicates a valid connection between the integrated circuit chip and the electrical lead. Slow, non-uniform, or inadequate transfer of heat to the lead indicates an insufficiency or failure in the electrical connection between the integrated circuit and the lead. Determination of the heat transferred from the integrated circuit chip to the lead can be by any appropriate method. For example, the temperature of the lead can be determined using temperature probe, a liquid crystal display, or an electronically or visually scanned infrared display.

REFERENCES:
patent: 3803413 (1974-04-01), Vanzetti et al.
patent: 4682605 (1987-07-01), Hoffman
patent: 4813588 (1989-03-01), Srivastava et al.
patent: 5052816 (1991-10-01), Nakamura et al.
patent: 5080279 (1992-01-01), Davison
patent: 5201841 (1993-04-01), Lebeau et al.

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