Non-contact cool-down station for wafers

Details Non-contact cool-down station for wafers Non-contact cool-down station for wafers

2006-12-12

2006-12-12

Hassazadeh, Parviz (Department: 1763)

Coating apparatus

Gas or vapor deposition

With treating means

C118S500000, C118S728000

Reexamination Certificate

active

07147720

ABSTRACT:
A stationary cooling station for cooling wafers after the wafers have been subjected to semiconductor processing supports the wafer by flowing gas in accordance with the Bernoulli principle. An upper wall of the cooling station contains a plurality of gas outlets that direct gas to flow over the top surface of the wafer. In this way, a low-pressure region is created over the wafer and the wafer is suspended within the cooling station, without directly contacting any surface for support. In addition to providing lift for the wafer, the gas is a thermally conductive gas that can cool the wafer by conducting heat away from it.

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