Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1987-08-27
1989-03-07
Dees, Jose G.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430318, 430320, 437220, 357 69, 357 70, 704 15, G03C 500
Patent
active
048106208
ABSTRACT:
An improved copper bump tape for tape automated bonding inhibits electromigration of the copper after bonding to a semiconductor device. The improved tape is characterized by the plating of a migration resistant metal onto the inner ends of connector beams of the tape. The migration resistant metal is coated onto all surfaces of the connector bump, except for the surface which is to be bonded to the semiconductor device. In this way, the surfaces of the bump which remain exposed after connection to the semiconductor are inhibited from electromigration.
REFERENCES:
patent: 4209355 (1980-06-01), Burns
patent: 4210926 (1980-07-01), Hacke
Divyesh P. Shah
Hilton Robert E.
Takiar Hem P.
Aaker Mark
Dees Jos,e G.
National Semiconductor Corporation
Patch Lee
Woodward Gail W.
LandOfFree
Nickel plated tape does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Nickel plated tape, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Nickel plated tape will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1668242