Nickel etching process and solution

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156656, 156664, 156902, 252 792, 252 794, C23F 102

Patent

active

045564493

ABSTRACT:
Process and solution for etching nickel and nickel alloys, particularly suitable for use in the manufacture of printed circuit boards. The nickel or alloy is contacted with an aqueous solution of nitric acid, nickel nitrate, a halogen additive and a surfactant. In some embodiments, a small amount of an amino acid is included in the solution to enhance the smoothness of the edges of the etched patterns.

REFERENCES:
patent: 4302246 (1981-11-01), Brindisi et al.

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