Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1984-10-15
1985-12-03
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156656, 156664, 156902, 252 792, 252 794, C23F 102
Patent
active
045564493
ABSTRACT:
Process and solution for etching nickel and nickel alloys, particularly suitable for use in the manufacture of printed circuit boards. The nickel or alloy is contacted with an aqueous solution of nitric acid, nickel nitrate, a halogen additive and a surfactant. In some embodiments, a small amount of an amino acid is included in the solution to enhance the smoothness of the edges of the etched patterns.
REFERENCES:
patent: 4302246 (1981-11-01), Brindisi et al.
Powell William A.
PSI Star
LandOfFree
Nickel etching process and solution does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Nickel etching process and solution, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Nickel etching process and solution will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1393181