Negative-working photoresist composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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430176, 430192, G03F 7038

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active

057006253

ABSTRACT:
Disclosed is a novel chemical-sensitization type negative-working photoresist composition capable of exhibiting high sensitivity to actinic rays and giving a patterned resist layer with high resolution and excellently orthogonal cross sectional profile of the patterned resist layer without occurrence of microbridges. The composition comprises (a) a poly(hydroxystyrene)-based resin; (b) a compound capable of releasing an acid by the irradiation with actinic rays such as tris(2,3-dibromopropyl) isocyanurate; and (c) a crosslinking agent such as a urea resin and melamine resin, each in a specified weight proportion, the poly(hydroxystyrene)-based resin as the component (a) having such a dispersion of the molecular weight distribution that the ratio of the weight-average molecular weight M.sub.w to the number-average molecular weight M.sub.n does not exceed 1.4 and being substantially free from low molecular weight fractions including unpolymerized monomer and oligomers having a molecular weight smaller than 1000.

REFERENCES:
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patent: 5352564 (1994-10-01), Takeda et al.
patent: 5514520 (1996-05-01), Thackeray et al.
patent: 5541263 (1996-07-01), Thackeray et al.
patent: 5547812 (1996-08-01), Collins et al.

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