Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1996-04-05
1998-08-04
Chu, John S.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430170, 430920, 430921, 430925, 430927, 522 31, 522 63, 522 67, G03F 7038, G03C 173
Patent
active
057891362
ABSTRACT:
Proposed is an alkali-developable negative-working photoresist composition in the form of a solution capable of exhibiting high sensitivity and greatly improved stability of the resist layer of the composition on a substrate surface after pattern-wise exposure to actinic rays and kept for a substantial length of time before further processing. The photoresist composition comprises, as the essential ingredients, (a) an alkali-soluble resin such as a copolymer of hydroxystyrene and styrene; (b) a compound capable of releasing an acid when irradiated with actinic rays such as tris(2,3-dibromopropyl) isocyanurate; (c) a crosslinking agent selected from the group consisting of melamine resins and urea resins substituted at the N-positions by methylol groups, alkoxy methyl groups or a combination thereof; and (d) a sensitivity improver which is hexa(methoxymethyl) melamine or di(methoxymethyl) urea, each in a specified proportion.
REFERENCES:
patent: 5034304 (1991-07-01), Feely
patent: 5118582 (1992-06-01), Ueno et al.
patent: 5204225 (1993-04-01), Feely
patent: 5227276 (1993-07-01), Roeschert et al.
patent: 5230985 (1993-07-01), Lohaus et al.
patent: 5256522 (1993-10-01), Spak et al.
patent: 5298364 (1994-03-01), Pawlowski et al.
patent: 5340697 (1994-08-01), Yoshimoto et al.
patent: 5376504 (1994-12-01), Graziano et al.
patent: 5397685 (1995-03-01), Daniels et al.
patent: 5529885 (1996-06-01), Ochiai et al.
Iguchi Etsuko
Ishikawa Kiyoshi
Kaneko Fumitake
Oomori Katsumi
Sato Mitsuru
Chu John S.
Tokyo Ohka Kogyo Co. Ltd.
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