Negative type photosensitive resin composition and method for fo

Details Negative type photosensitive resin composition and method for fo Negative type photosensitive resin composition and method for fo

1998-09-16

2000-10-31

Baxter, Janet

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

G03F 730

Patent

active

061400254

ABSTRACT:
A negative type photosensitive resin composition is herein disclosed which is used under the irradiation circumstance of a safelight having a maximum wavelength within the range of 500 to 620 nm and a large spectral luminous efficiency; the composition being a liquid or a solid resin composition containing a photocurable resin, a photoreaction initiator and if necessary, a photosensitizing dye; an absorbancy of an unexposed film formed from this composition being 0.5 or less within the range of the maximum wavelength .+-.30 nm selected from the range of the maximum wavelength of the safelight. By the use of this negative type photosensitive resin composition, it is possible to form a resist pattern which is excellent in safe operativity, operational efficiency, the quality stability of products, and the like.

REFERENCES:
patent: 4548890 (1985-10-01), Dickinson et al.
patent: 5055439 (1991-10-01), Allen et al.
patent: 5849809 (1998-12-01), Narang et al.
Focal Encyclopedea of Photography, Fletcher and Son, Great Britain, 1969, pp. 1313-1315.

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