Negative offset bipolar electrostatic chucks

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field

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361235, 279128, H02N 1300

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active

058353330

ABSTRACT:
A bipolar electrostatic chuck system having a bipolar electrostatic chuck for securely holding a wafer on the surface of the bipolar electrostatic chuck. The bipolar electrostatic chuck system includes a negative-offset power supply for providing a positive potential level and a negative potential level. The positive potential level is positively biased relative to a common reference voltage level by a first magnitude while the negative potential level is negatively biased relative to the same common reference voltage level by a second magnitude, which is larger than the first magnitude. Further, the bipolar electrostatic chuck includes a positive pole, which is coupled to the negative-offset power supply for biasing the positive pole at the positive potential level when the negative-offset power supply is turned on. Additionally, the bipolar electrostatic chuck includes a negative pole, which is coupled to the negative-offset power supply for biasing the negative pole at the negative potential level when the negative-offset power supply is turned on.

REFERENCES:
patent: 3933509 (1976-01-01), McGinty
patent: 3993509 (1976-11-01), McGinty
patent: 4184188 (1980-01-01), Briglia
patent: 4384918 (1983-05-01), Abe
patent: 4431473 (1984-02-01), Okano et al.
patent: 4464223 (1984-08-01), Gorin
patent: 4502094 (1985-02-01), Lewin et al.
patent: 4554611 (1985-11-01), Lewin
patent: 4579618 (1986-04-01), Celestino et al.
patent: 4645218 (1987-02-01), Ooshio et al.
patent: 4665463 (1987-05-01), Ward et al.
patent: 4692836 (1987-09-01), Suzuki
patent: 4724510 (1988-02-01), Wicker et al.
patent: 4842683 (1989-06-01), Cheng et al.
patent: 4897171 (1990-01-01), Ohmi
patent: 4962441 (1990-10-01), Collins
patent: 4983254 (1991-01-01), Fujimura et al.
patent: 5055964 (1991-10-01), Logan et al.
patent: 5103367 (1992-04-01), Horwitz et al.
patent: 5104834 (1992-04-01), Watanabe et al.
patent: 5110438 (1992-05-01), Ohmi et al.
patent: 5117121 (1992-05-01), Watanabe et al.
patent: 5151845 (1992-09-01), Watanabe et al.
patent: 5160152 (1992-11-01), Toraguchi et al.
patent: 5179498 (1993-01-01), Hongoh et al.
patent: 5191506 (1993-03-01), Logan et al.
patent: 5325261 (1994-06-01), Horwitz
patent: 5326725 (1994-07-01), Sherstinksy et al.
patent: 5350479 (1994-09-01), Collins et al.
patent: 5459632 (1995-10-01), Birang et al.
patent: 5463525 (1995-10-01), Barnes et al.
patent: 5467249 (1995-11-01), Barnes et al.
patent: 5535507 (1996-07-01), Barnes et al.
patent: 5557215 (1996-09-01), Saeki et al.
patent: 5561585 (1996-10-01), Barnes et al.
Unknown, "Patent Abstracts of Japan," vol. 095, No. 002, & JP 06 326176A, Tokyo Electron, Ltd., Nov. 25, 1994 (Publication date).
Unknown, "Patent Abstracts of Japan," vol. 18, No. 599 (E-1631), & JP 06 232089A, Tokyo Electron, Ltd., Aug. 19, 1994 (Publication Date).
Yunji Ra and Ching-Hwa Chen, "Direct current bias as an ion current monitor in the transformer coupled plasma etcher", vol. 11, No. 6, Nov. 1, 1993, pp. 2911-2913, Journal of Vacuum Science and Technology, Woodbury, NY.
Watanabe, Toshiya, et al., Relationship between Electrical Resistivity and Electrostatic Force and Alumina Electrostatic Chuck, Feb. 1993, Jpn. J. Appl. Phys. vol. 32, pp. 864-871, Part 1, No. 2.
Watanabe, T., et al., Electrostatic charge distribution in the dielectric layer of alumina electrostatic chuck, 1994, Journal of Materials Science 29, pp. 3510-3516.
Field, John, Wafer Handling, Electrostatic wafer clamping for next-generation manufacturing, Sep., 1994, Solid State Technology.
Daviel, J.F., et al., Electrostatic Clamping Applied to Semiconductor Plasma Processing, I. Theoretical Modeling, Nov. 1993,J. Electrochem. Soc., No. 11.
Wright, D.R., et al., Manufacturing issues of electrostatic chucks, Jul./Aug. 1995, J. Vac. Sci. Technol. B.
Daviel, J.F., et al., Electrostatic Clamping Applied to Semicondutor Plasma Processing II. Experimental Results, J. Electrochem., Soc., vol. 140, No. 11, Nov. 1993.

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