Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-06-05
2007-06-05
Clark, S. V. (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C977S723000, C438S631000
Reexamination Certificate
active
10990273
ABSTRACT:
An integrated circuit and a method of manufacturing an integrated circuit is provided including providing an integrated circuit having a trench and via provided in a dielectric layer. A nano-electrode-array is formed over the dielectric layer in the trench and via, and a conductor is deposited over the nano-electrode-array. The conductor and the nano-electrode-array are coplanar with a surface of the dielectric layer.
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Fiordalice Robert
Ivanov Igor
Kolics Artur
Kong Wen Z.
Lopatin Sergey D.
Clark S. V.
Ishimaru Mikio
KLA-Tencor Technologies Corporation
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