Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2011-03-08
2011-03-08
Arora, Ajay K (Department: 2892)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S744000, C257SE21108, C257SE29070, C257S024000
Reexamination Certificate
active
07902089
ABSTRACT:
An object of the present invention is to provide a new n-type transistor, different from the prior art, using a channel having a nanotube-shaped structure, and having n-type semiconductive properties. To realize this, a film of a nitrogenous compound6is formed directly on a channel5of a transistor1comprising a source electrode2, a drain electrode3, a gate electrode4and the n-type channel5having a nanotube-shaped structure and provided between the source electrode2and the drain electrode3.
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Kojima Atsuhiko
Matsumoto Kazuhiko
Nagao Satoru
Arora Ajay K
Japan Science and Technology Agency
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
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