Multiple leadframe laminated IC package

Details Multiple leadframe laminated IC package Multiple leadframe laminated IC package

2003-10-09

2008-11-11

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S670000

Reexamination Certificate

active

07449771

ABSTRACT:
A method of fabricating an integrated circuit package. The method includes providing a first leadframe and a second leadframe, laminating the second leadframe to a portion of the first leadframe in order to create a multi-layer laminated leadframe, and mounting a semiconductor die on another portion of the first leadframe.

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Wolf et al., Silicon Processing for the VLSI Era, 2000, vol. I, Lattice Press, 857-858.

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