Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2003-10-09
2008-11-11
Andújar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S670000
Reexamination Certificate
active
07449771
ABSTRACT:
A method of fabricating an integrated circuit package. The method includes providing a first leadframe and a second leadframe, laminating the second leadframe to a portion of the first leadframe in order to create a multi-layer laminated leadframe, and mounting a semiconductor die on another portion of the first leadframe.
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Wolf et al., Silicon Processing for the VLSI Era, 2000, vol. I, Lattice Press, 857-858.
Fan Chun Ho
Kwan Kin Pui
Lau Wing Him
Lin Tsui Yee
Tse Shui Ming
Andújar Leonardo
ASAT Ltd.
Morrison & Foerster / LLP
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