Wave transmission lines and networks – Long lines – Strip type
Patent
1987-12-14
1989-02-07
Gensler, Paul
Wave transmission lines and networks
Long lines
Strip type
29830, 2281802, 361414, 428450, 428901, H01P 308, H05K 336, B32B 906, B23K 3102
Patent
active
048034509
ABSTRACT:
Multilayer circuit boards composed primarily of silicon and containing buried ground planes and buried conducting runs are fabricated in one embodiment by positioning conductive patterns (12) on the surfaces of silicon substrates and melting a solder component of the conductive patterns (12) and allowing it to flow together with solder from the conductive patterns (12) on a stacked, adjacent silicon substrate (10). When the solder cools, a single conductive pathway (18) exists between adjacent silicon substrates (10) and bonds the adjacent substrates. If the substrates are coated with SiO.sub.2 (20), a multilayer structure with buried microwave strip lines (22) is formed in the bonding process. Alternatively, highly resistive silicon substrates (26) are used as a dielectric for microwave strip lines (24) on a top surface thereof and a conductive sheet (28) on the bottom surface thereof acts as a ground plane for microwave energy propagating along strip line (24).
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Burgess James F.
Glascock, II Homer H.
Loughran James A.
Neugebauer Constantine A.
Webster Harold F.
Davis Jr. James C.
General Electric Company
Gensler Paul
Snyder Marvin
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