4. Metal treatment
  5. Barrier layer stock material, p-n type

James A. Loughran

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Direct bonding of metals to ceramics and metals

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
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Double side cooled, pressure mounted semiconductor package and p

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
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Drilled, diffused radiation detector

Radiant energy – Ionic separation or analysis – Static field-type ion path-bending selecting means
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High-aspect-ratio hollow diffused regions in a semiconductor bod

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Low loss, multilevel silicon circuit board

Electricity: electrical systems and devices – Miscellaneous
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Profile ID: LFUS-PAI-P-590908

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