Multichip module package and fabrication method

Details Multichip module package and fabrication method Multichip module package and fabrication method

2005-09-13

2005-09-13

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S686000, C257S706000, C257S777000

Reexamination Certificate

active

06943057

ABSTRACT:
A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.

REFERENCES:
patent: 5396403 (1995-03-01), Patel
patent: 6529379 (2003-03-01), Fuller et al.
patent: 2004/0042185 (2004-03-01), Kung et al.
patent: 2004/0212071 (2004-10-01), Moshayedi

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