Multi-step system and method for curing a dielectric film

Details Multi-step system and method for curing a dielectric film Multi-step system and method for curing a dielectric film

2005-11-09

2009-11-24

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C118S643000, C118S724000, C257SE21241, C438S795000

Reexamination Certificate

active

07622378

ABSTRACT:
A multi-step system and method for curing a dielectric film in which the system includes a drying system configured to reduce the amount of contaminants, such as moisture, in the dielectric film. The system further includes a curing system coupled to the drying system, and configured to treat the dielectric film with ultraviolet (UV) radiation and infrared (IR) radiation in order to cure the dielectric film.

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