Multi-ledge substrate support for a thermal processing chamber

Details Multi-ledge substrate support for a thermal processing chamber Multi-ledge substrate support for a thermal processing chamber

1998-04-01

2000-04-11

Lund, Jeffrie R

Coating apparatus

Gas or vapor deposition

With treating means

118728, 118729, 118730, 118500, 4272481, 134 2, 134 3, 134 19, 134 254, 134 32, 134 33, 1341041, 156345, 216 58, 216 63, C23C 1600, C23F 102

Patent

active

060484039

ABSTRACT:
A substrate support, for example an edge ring, includes an upper ledge for supporting a first substrate, such as a semiconductor wafer, during a first process, and a lower ledge contiguous with the upper ledge for supporting a second substrate during a second process for cleaning the substrate support. A method of processing substrates supported by the edge ring in a thermal process chamber is also disclosed.

REFERENCES:
patent: 698031 (1902-04-01), Leslie
patent: 1850684 (1932-03-01), Nathan
patent: 3436255 (1969-04-01), Harris et al.
patent: 3622427 (1971-11-01), Kelly
patent: 4365588 (1982-12-01), Jolly
patent: 4770630 (1988-09-01), Akimoto et al.
patent: 4978567 (1990-12-01), Miller
patent: 5169684 (1992-12-01), Takagi
patent: 5316472 (1994-05-01), Niino et al.
patent: 5431561 (1995-07-01), Yamabe et al.
patent: 5474612 (1995-12-01), Sato et al.
patent: 5482559 (1996-01-01), Imai et al.
patent: 5556275 (1996-09-01), Sakata et al.
patent: 5584936 (1996-12-01), Pickering et al.
patent: 5616208 (1997-04-01), Lee
patent: 5637153 (1997-06-01), Niino et al.
patent: 5660472 (1997-08-01), Peuse et al.
patent: 5671119 (1997-09-01), Huang et al.
patent: 5746928 (1998-05-01), Yen et al.
patent: 5871588 (1999-02-01), Moslehi et al.

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