Multi-leadframe semiconductor package and method of manufacture

Details Multi-leadframe semiconductor package and method of manufacture Multi-leadframe semiconductor package and method of manufacture

2005-02-07

2009-06-30

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257SE23039, C257SE23042, C257SE23046, C257SE23051, C257SE23124, C257S712000, C257S713000, C257S717000, C257S720000, C257S676000, C257S684000, C257S796000, C438S123000

Reexamination Certificate

active

07554179

ABSTRACT:
A multi-leadframe semiconductor package and method of manufacture includes a first leadframe having a die pad and a plurality of contact leads around the periphery of the die pad. A die is attached to the die pad and electrically connected to the plurality of contact leads. A heat spreader leadframe having a heat spreader and a plurality of terminal leads around the periphery of the heat spreader is provided. The die pad is attached to the heat spreader, and the plurality of contact leads is attached to the plurality of terminal leads.

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