Multi-layer dielectric containing diffusion barrier material

Details Multi-layer dielectric containing diffusion barrier material Multi-layer dielectric containing diffusion barrier material

2006-12-05

2006-12-05

Schillinger, Laura M. (Department: 2813)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Multiple layers

C438S528000, C438S287000

Reexamination Certificate

active

07144825

ABSTRACT:
A method for forming a dielectric is disclosed. The method comprises forming a first dielectric layer over semiconductor material. A diffusion barrier material is introduced into the first dielectric layer. Lastly, a second dielectric layer is formed over the first dielectric layer after the introducing.

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