Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2006-12-26
2006-12-26
Quach, T. N. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S723000, C257S676000
Reexamination Certificate
active
07154186
ABSTRACT:
A multichip module package uses bond wire with plastic resin on one side of a lead frame to package an integrated circuit and flip chip techniques to attach one or more mosfets to the other side of the lead frame. The assembled multichip module30has an integrated circuit controller14on a central die pad. Wire bonds16extend from contact areas on the integrated circuit to outer leads2.6of the lead frame10. On the opposite, lower side of the central die pad, the sources and gates of the mosfets24, 26are bump or stud attached to the half etched regions of the lead frame. The drains36of the mosfets and the ball contacts22.1on the outer leads are soldered to a printed circuit board.
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Choi Seung Yong
Joshi Rajeev
Noquil Jonathan A.
Wu Chung-Lin
Fairchild Semiconductor Corporation
FitzGerald Esq. Thomas R.
Hiscock & Barclay LLP
Quach T. N.
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