Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-11-15
2005-11-15
Graybill, David E. (Department: 2827)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S112000, C438S118000, C438S126000, C438S598000, C438S611000, C438S613000, C438S622000, C438S459000, C438S977000
Reexamination Certificate
active
06964881
ABSTRACT:
The present invention defines a packaging implementation providing a multichip multilayer system on a chip solution. Greater integration of a plurality and variety of known good die are contained within cavities formed in a separate substrate is achieved. Additional redistribution and interconnect layers above the multichip configuration may be formed with the redistribution layers terminating in electrical connections such as conductive bumps or balls. In one embodiment, the cavities of the substrate receive signal device connections, such as conductive bumps, of a plurality of semiconductor dice in a flip-chip configuration. A portion of the back surface of the substrate is then removed to a depth sufficient to expose the conductive bumps. In another embodiment, the cavities receive the semiconductor dice with the active surface of the semiconductor dice facing up, wherein metal layer connections are formed and coupled bond pads or other electrical connectors of the semiconductor dice.
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Boon Suan Jeung
Chia Yong Poo
Chua Swee Kwang
Eng Meow Koon
Huang Suangwu
Graybill David E.
Micro)n Technology, Inc.
TraskBritt
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