4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Kishor Desai

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Dual chip in package with a wire bonded die mounted to a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Flip chip ball grid array package with laminated substrate

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Method for manufacturing a dual chip in package with a flip...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of forming electrolytic contact pads including layers...

Semiconductor device manufacturing: process – Direct application of electrical current – Electromigration
Reexamination Certificate

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Multi chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-696396

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