Multi-bit stacked-type non-volatile memory and manufacture...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S259000, C438S563000, C438S593000, C438S594000

Reexamination Certificate

active

06995061

ABSTRACT:
The present invention discloses a multi-bit stacked-type non-volatile memory having a spacer-shaped floating gate and a manufacturing method thereof. The manufacturing method includes forming a patterned dielectric layer containing arsenic on a semiconductor substrate, wherein the patterned dielectric layer defines an opening as an active area. A dielectric spacer is formed on a side wall of the patterned dielectric layer and a gate dielectric layer is formed on the semiconductor substrate. A source/drain region is formed by thermal driving method making arsenic diffusion from the patterned dielectric layer into the semiconductor substrate. A spacer-shaped floating gate is formed on the side wall of the dielectric spacer and the gate dielectric layer. An interlayer dielectric layer is formed on the spacer-shaped floating gate. A control gate is formed on the interlayer dielectric layer and fills the opening of the active area.

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patent: 6153904 (2000-11-01), Yang
patent: 6155537 (2000-12-01), Yang
patent: 6635533 (2003-10-01), Chang et al.
patent: 2002/0130357 (2002-09-01), Hurley et al.
patent: 2004/0033657 (2004-02-01), Chuang et al.
patent: 2004/0207007 (2004-10-01), Lin et al.
patent: 2004/0214393 (2004-10-01), Chern

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