MOSFET with reduced leakage current

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438230, 438213, 438227, 438218, H01L 218238

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active

058245774

ABSTRACT:
A metal-oxide-semiconductor field effect transistor (MOSFET) with reduced leakage current includes drain and source regions separated by a channel, a drain terminal over a portion of the drain region, a source terminal over a portion of the source region and a gate terminal opposite the channel. An oxide layer is deposited over the remaining portions of the drain and source regions, as well as on the adjacent vertical sides and top edges of the drain, source and gate terminals. A silicide layer is deposited over the gate terminal between the oxide-covered top edges thereof and over the drain and source terminal up to the oxide-covered top edges thereof. With oxide over the drain source regions instead of silicide, parasitic Schottky diodes are avoided, thereby eliminating leakage current due to such parasitic elements. Additionally, the oxide layer over the drain and source regions blocks pldd and nldd diffusions, thereby preventing impingement of the drain and source regions under the gate and adjacent oxide spacers and thereby significantly reducing leakage current due to band-to-band tunneling.

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Chi Chang, et al., "Corner-Field Induced Drain Leakage in Thin Oxide MOSFETs," IEEE 1987, pp. 714-717.
T.Y. Chan, et al., "The Impact of Gate-Induced Drain Leakage Current on MOSFET Scaling," IEEE 1987, pp.718-721.

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