MOSFET devices and methods of making

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S510000, C438S514000, C257SE21170, C257SE21051, C257SE21058, C257SE21227, C257SE21247, C257SE21248, C257SE21421

Reexamination Certificate

active

07829402

ABSTRACT:
A MOSFET device and a method for fabricating MOSFET devices are disclosed. The method includes providing a semiconductor device structure including a semiconductor device layer of a first conductivity type, and ion implanting a well structure of a second conductivity type in the semiconductor device layer, where the ion implanting includes providing a dopant concentration profile in a single mask implant sequence.

REFERENCES:
patent: 6054352 (2000-04-01), Ueno
patent: 6107142 (2000-08-01), Suvorov et al.
patent: 6238980 (2001-05-01), Ueno
patent: 6429041 (2002-08-01), Ryu et al.
patent: 6639273 (2003-10-01), Ueno
patent: 6956238 (2005-10-01), Ryu et al.
patent: 7074643 (2006-07-01), Ryu
patent: 7221010 (2007-05-01), Ryu
patent: 7285465 (2007-10-01), Tarui et al.
patent: 7381992 (2008-06-01), Ryu
patent: 2006/0192256 (2006-08-01), Cooper et al.
patent: 2007/0126007 (2007-06-01), Matocha
patent: 1775774 (2007-04-01), None
patent: WO03100864 (2003-12-01), None
Asmita Saha and James A. Cooper; A 1-kV 4H-SiC Power DMOSFET Optimized for Low ON-Resistance; IEEE Transactions on Electron Devices; Oct. 2007; pp. 2786-2791; vol. 54, No. 10.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

MOSFET devices and methods of making does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with MOSFET devices and methods of making, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and MOSFET devices and methods of making will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4251211

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.