MOS devices with improved source/drain regions with SiGe

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S288000, C257SE21431, C438S300000

Reexamination Certificate

active

07989901

ABSTRACT:
A semiconductor structure and methods for forming the same are provided. The semiconductor structure includes a semiconductor substrate; a gate stack on the semiconductor substrate; a SiGe region in the semiconductor substrate and adjacent the gate stack, wherein the SiGe region has a first atomic percentage of germanium to germanium and silicon; and a silicide region over the SiGe region. The silicide region has a second atomic percentage of germanium to germanium and silicon. The second atomic percentage is substantially lower than the first atomic percentage.

REFERENCES:
patent: 5534713 (1996-07-01), Ismail et al.
patent: 6846715 (2005-01-01), Fitzgerald et al.
patent: 6885084 (2005-04-01), Murthy et al.
patent: 7407860 (2008-08-01), Kim et al.
patent: 7534689 (2009-05-01), Pal et al.
patent: 2003/0089901 (2003-05-01), Fitzgerald
patent: 2006/0073665 (2006-04-01), Jain
patent: 2008/0023773 (2008-01-01), Shimamune et al.
patent: 101114673 (2008-01-01), None
patent: 101578690 (2009-11-01), None
Thompson, S. E., et al., “A Logic Nanotechnology Featuring Strained-Silicon,” IEEE Electron Device Letters, Apr. 2004, vol. 25, No. 4, pp. 191-193.
Kumagai, et al., “Evaluation of Change in Drain Current Due to Strain in 0.13-μm-node MOSFETs,” Extended Abstracts of the 2002 International Conference on Solid State Devices and Materials, 2002, pp. 14-15, Nagoya.
Ray, S. K., et al., “Low Thermal Budget NiSi Films on SiGe Alloys,” Materials Research Society, 2003, pp. N6.6.1-N6.6.6, vol. 745.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

MOS devices with improved source/drain regions with SiGe does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with MOS devices with improved source/drain regions with SiGe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and MOS devices with improved source/drain regions with SiGe will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2624089

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.