Monitoring substrate processing by detecting reflectively...

Details Monitoring substrate processing by detecting reflectively... Monitoring substrate processing by detecting reflectively...

2005-02-01

2005-02-01

Hassanzadeh, Parviz (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With measuring, sensing, detection or process control means

C118S712000, C438S007000

Reexamination Certificate

active

06849151

ABSTRACT:
A substrate is placed in a process zone and an energized process gas is maintained in the process zone to process the substrate. A light beam is reflectively diffracted from a pattern of features of the substrate being processed, the reflected beam is monitored, and a signal is generated in relation to the monitored beam. During processing, a width of the features of the substrate can change. The generated signal is evaluated to detect the occurrence of a change in the width of the features.

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