Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2011-03-15
2011-03-15
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S675000, C257S706000, C257S778000, C257S782000, C257SE33075, C257SE23051, C257SE21511, C257SE21514, C438S106000, C438S108000, C438S118000, C438S119000, C438S122000
Reexamination Certificate
active
07906857
ABSTRACT:
A molded integrated circuit package is described. The molded integrated circuit package comprises a substrate having a plurality of contacts on a first surface; a die having a plurality of solder bumps on a first surface, the plurality of solder bumps being coupled to the plurality of contacts on the first surface of the substrate; an adhesive material positioned on a second surface of the die; a lid attached to the adhesive material; and an encapsulant positioned between the lid and the substrate. Methods of forming molded integrated circuit packages are also disclosed.
REFERENCES:
patent: 5105259 (1992-04-01), McShane et al.
patent: 5436407 (1995-07-01), Fehr et al.
patent: 5455456 (1995-10-01), Newman
patent: 5705851 (1998-01-01), Mostafazadeh et al.
patent: 5889323 (1999-03-01), Tachibana
patent: 5909056 (1999-06-01), Mertol
patent: 6225694 (2001-05-01), Terui
patent: 6225695 (2001-05-01), Chia et al.
patent: 6288900 (2001-09-01), Johnson et al.
patent: 6504096 (2003-01-01), Okubora
patent: 6538320 (2003-03-01), Tosaya et al.
patent: 6573590 (2003-06-01), Radu
patent: 6597575 (2003-07-01), Matayabas et al.
patent: 6713863 (2004-03-01), Murayama
patent: 6770113 (2004-08-01), Vikram et al.
patent: 6847106 (2005-01-01), Howard et al.
patent: 6849942 (2005-02-01), Lin et al.
patent: 6882535 (2005-04-01), Labanok et al.
patent: 6919630 (2005-07-01), Hsiao
patent: 7012326 (2006-03-01), Wu et al.
patent: 7091603 (2006-08-01), Mamitsu et al.
patent: 7361995 (2008-04-01), Goh et al.
patent: 7402906 (2008-07-01), Rahman Khan et al.
patent: 2004/0121521 (2004-06-01), Jackson et al.
patent: 2004/0174682 (2004-09-01), Lin et al.
patent: 2004/0238947 (2004-12-01), Rumer
patent: 2005/0077614 (2005-04-01), Chengalva et al.
patent: 2008/0157300 (2008-07-01), Chuang et al.
Chaware Raghunandan
Hoang Lan H.
Yip Laurene
Clark Jasmine J
George Thomas
King John J.
Xilinx , Inc.
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