Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2008-04-22
2008-04-22
Jackson, Jerome (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S780000
Reexamination Certificate
active
10543301
ABSTRACT:
A thermally enhanced ball grid array package is disclosed. The package includes a base layer element and a flip chip die mounted on the base layer element. The die has a first surface electrically coupled to the base layer element, a second surface opposite to the first surface, and lateral sides. A molding compound encapsulates the base layer element and the lateral sides of the die. A surface is formed of the second surface of the die and an upper surface of the molding compound. A material is disposed on the surface, and a heat spreader is mounted on the material.
REFERENCES:
patent: 5605863 (1997-02-01), Wills et al.
patent: 5702426 (1997-12-01), Pons et al.
patent: 5909056 (1999-06-01), Mertol
patent: 6190945 (2001-02-01), Akram
patent: 6232152 (2001-05-01), DiStefano et al.
patent: 6359335 (2002-03-01), Distefano et al.
patent: 6444498 (2002-09-01), Huang et al.
patent: 2001/0032933 (2001-10-01), Thomson et al.
patent: 2001/0040300 (2001-11-01), Huang et al.
patent: 2002/0008316 (2002-01-01), Miyazaki
patent: 2002/0074669 (2002-06-01), Watanabe et al.
patent: 2002/0185717 (2002-12-01), Eghan et al.
patent: 2003/0148557 (2003-08-01), Lim et al.
Chong Desmond Yok Rue
Goh Kim Yong
Hoang Lan H.
Kapoor Rahul
Sun Anthony Yi-Sheng
Jackson Jerome
UTAC - United Test and Assembly Test Center Ltd.
Valentine Jami M
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