Molded high density electronic packaging structure for high...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

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Details

C257S780000

Reexamination Certificate

active

10543301

ABSTRACT:
A thermally enhanced ball grid array package is disclosed. The package includes a base layer element and a flip chip die mounted on the base layer element. The die has a first surface electrically coupled to the base layer element, a second surface opposite to the first surface, and lateral sides. A molding compound encapsulates the base layer element and the lateral sides of the die. A surface is formed of the second surface of the die and an upper surface of the molding compound. A material is disposed on the surface, and a heat spreader is mounted on the material.

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