Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2008-04-22
2008-04-22
Jackson, Jerome (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S780000
Reexamination Certificate
active
07361995
ABSTRACT:
A thermally enhanced ball grid array package is disclosed. The package includes a base layer element and a flip chip die mounted on the base layer element. The die has a first surface electrically coupled to the base layer element, a second surface opposite to the first surface, and lateral sides. A molding compound encapsulates the base layer element and the lateral sides of the die. A surface is formed of the second surface of the die and an upper surface of the molding compound. A material is disposed on the surface, and a heat spreader is mounted on the material.
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Chong Desmond Yok Rue
Goh Kim Yong
Hoang Lan H.
Kapoor Rahul
Sun Anthony Yi-Sheng
Jackson Jerome
Sughrue & Mion, PLLC
UTAC - United Test and Assembly Test Center Ltd.
Valentine Jami M
Xilinx , Inc.
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