Mold for encapsulating a semiconductor chip

Details Mold for encapsulating a semiconductor chip Mold for encapsulating a semiconductor chip

2005-03-01

2005-03-01

Heitbrink, Tim (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

And means to form or reshape preform

C425S116000, C425S125000, C425S127000, C425S129100, C425S556000, C264S272150

Reexamination Certificate

active

06860731

ABSTRACT:
A mold has two mold halves (6, 7). One of the mold halves (6) includes a contact section (8) which is adapted to contact a surface (5) of a semiconductor chip (1) mounted in the mold, in use.

REFERENCES:
patent: 4044984 (1977-08-01), Shimizu et al.
patent: 4697784 (1987-10-01), Schmid
patent: 5059105 (1991-10-01), Baird
patent: 5779958 (1998-07-01), Nishihara et al.
patent: 5997798 (1999-12-01), Tetreault et al.
patent: 6019588 (2000-02-01), Peters et al.
patent: 6193493 (2001-02-01), Steijer et al.
patent: 6435855 (2002-08-01), Sakurai

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