4. Plastic article or earthenware shaping or treating: apparatus
  5. Distinct means to feed, support or manipulate preform stock...
  6. Opposed registering coacting female molds

Man Ho Hui

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Mold and method for encapsulation of electronic device

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Mold for encapsulating a semiconductor chip

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – And means to form or reshape preform
Reexamination Certificate

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Molding apparatus

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2716179

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