4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Outside periphery of package having specified shape or...

Srikanth Narasimulau

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Mold for a semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

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Mold for encapsulating a semiconductor chip

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – And means to form or reshape preform
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2732715

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