MOCVD reactor system for indium antimonide epitaxial material

Coating apparatus – Gas or vapor deposition – Work support

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118715, 118726, C23C 1600

Patent

active

057025320

ABSTRACT:
Multiple solid precursor bubblers are used to alleviate channeling effects caused by high carrying gas flow rates to provide for deposition of indium-based epitaxial materials in high-capacity MOCVD reactor systems. Precracking of precursor materials that exhibit higher dissociation temperatures using heated manifolds or heated susceptor, and rotation of individual wafers in a multi-wafer reactor chamber enhance thickness uniformity, surface morphology and electronic properties of deposited epitaxial layers.

REFERENCES:
patent: 3783822 (1974-01-01), Wollam
patent: 3853091 (1974-12-01), Christensen
patent: 4582480 (1986-04-01), Lynch
patent: 4704988 (1987-11-01), Mellet
patent: 4851256 (1989-07-01), Matsuyama
patent: 4860687 (1989-08-01), Frijlink
patent: 4911101 (1990-03-01), Ballingall, III
patent: 4980204 (1990-12-01), Fujii
patent: 5203925 (1993-04-01), Shibuya
patent: 5211758 (1993-05-01), Ota
patent: 5227340 (1993-07-01), Pintchovski
patent: 5334277 (1994-08-01), Nakamura
patent: 5380367 (1995-01-01), Bertone
patent: 5421895 (1995-06-01), Tsubouchi
patent: 5468299 (1995-11-01), Tsai
Powell, Carroll; Oxley, Joseph; Blocher, John; Vapor Deposition, 1966 pp. 269-276.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

MOCVD reactor system for indium antimonide epitaxial material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with MOCVD reactor system for indium antimonide epitaxial material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and MOCVD reactor system for indium antimonide epitaxial material will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-198599

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.