Mitigation of CMP-induced BPSG surface damage by an integrated a

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438759, H01L 218234

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active

059151757

ABSTRACT:
Healing of scratches created during CMP is achieved by reflowing the material containing the scratches and then depositing a top layer of material. The deposition of the top layer further enhances the healing of the scratches.

REFERENCES:
patent: 5395801 (1995-03-01), Doan et al.
patent: 5688720 (1997-11-01), Hayashi

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