MIM capacitor having flat diffusion prevention films

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S253000

Reexamination Certificate

active

07045415

ABSTRACT:
At present, Cu (copper) is being used as a wiring material. In an RF-CMOS device as a combination of an RF analog device and CMOS logic device, two electrodes of a MIM capacitor are formed from Cu having a large diffusion coefficient. To prevent Cu from diffusing to the capacitor insulating film of the MIM capacitor, diffusion prevention films having a function of preventing diffusion of Cu are interposed between the capacitor insulating film and the two electrodes. As a result, Cu forming the electrodes does not diffuse to the capacitor insulating film.

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R. Mahnkopf, et al., “System on a Chip Technology Platform for 0.18μm Digital, Mixed Signal & eDRAM Applications” IEDM 1999 Tech. Digest pp. 849-852.

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