Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1995-08-31
1997-11-18
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20429806, 20429811, 20429816, 20429812, C23C 1434
Patent
active
056883820
ABSTRACT:
A microwave plasma deposition source including a vacuum chamber for containing a substance to be energized in a plasma with microwave energy, a coaxial microwave feed ending in the chamber, a sputter target in the chamber and electrically isolated from the coaxial feed, and a second substrate spaced from the sputter target for defining a plasma volume between the substrates.
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Besen Matthew M.
Bourget Lawrence
Holber William M.
Post Richard S.
Smith Donald K.
Applied Science and Technology Inc.
Nguyen Nam
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