Microwave integrated circuit package to eliminate alumina substr

Details Microwave integrated circuit package to eliminate alumina substr Microwave integrated circuit package to eliminate alumina substr

1990-06-22

1992-04-07

Rowan, Kurt

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228239, 22826312, 22826313, B23K 3536, B23K 3522, B23K 3102

Patent

active

051020297

ABSTRACT:
A MIC package housing that reduces or completely eliminates alumina substrate cracking due to thermal expansion rate differences between the housing and the alumina by using a low-expansion iron-nickel alloy, such as commercially available Carpenter 49, made to ASTM Specification A-753-78 (Alloy 2) and MIL-N-14411B (MR) (Composition 3 and 4). Such a housing places compressive stresses on glass-to-metal seals used in hermetic feedthroughs and the glass is fused and the stresses relieved by a special process of annealing. Manufacturing yields are improved and very large alumina substrates can be used and are attached by hard soldering.

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Richardson, E. F., "Select Material to Balance . . . ", Microwaves & RF, Jul. 1989, pp. 87-95.
"Carpenter Controlled-Expansion Alloys", brochure by Carpenter Steel Div., Reading, Pa.

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