Thermal measuring and testing – Temperature measurement – In spaced noncontact relationship to specimen
Reexamination Certificate
2005-03-08
2005-03-08
Gutierrez, Diego (Department: 2859)
Thermal measuring and testing
Temperature measurement
In spaced noncontact relationship to specimen
C374S179000, C136S224000, C250S338300
Reexamination Certificate
active
06863438
ABSTRACT:
A micropatterned thermosensor, e.g., an infrared sensor, includes a supporting body and at least one thermocouple arranged thereon. The thermocouple also has a first material and a second material, which together form, at least in a pointwise manner, at least one thermal contact. Furthermore, it is provided that the first and/or the second material are configured at least regionally in the form of a meander-shaped or undulating-type circuit trace and extend on the supporting body. In addition, a micropatterned thermosensor having such patterned circuit traces, in which the first material is platinum or aluminum, and the second material is doped or undoped polysilicon-germanium.
REFERENCES:
patent: 3885992 (1975-05-01), Wilcox
patent: 4451690 (1984-05-01), Ishida
patent: 4456390 (1984-06-01), Junkert et al.
patent: 4850713 (1989-07-01), Thery et al.
patent: 5030827 (1991-07-01), Powell
patent: 5220189 (1993-06-01), Higashi et al.
patent: 5695283 (1997-12-01), Johnson
patent: 5982014 (1999-11-01), Paige
patent: 6203194 (2001-03-01), Beerwerth et al.
patent: 6211454 (2001-04-01), Sano
patent: 6297723 (2001-10-01), Shoji et al.
patent: 6300554 (2001-10-01), Du et al.
patent: 6348650 (2002-02-01), Endo et al.
patent: 20030052271 (2003-03-01), Fedder et al.
patent: 20030141455 (2003-07-01), Lambert et al.
patent: 199 32 308 (2001-01-01), None
patent: 100 09 593 (2001-09-01), None
patent: 0 999 437 (2000-05-01), None
patent: 1 204 718 (1960-01-01), None
patent: WO 9102229 (1991-02-01), None
Gerwen et al., “Thin-Film Boron-Doped Polycrystalline Silicon 70%- Germanium 30% Forthermopiles”, Sensors and Actuators A, El Sevier Sequoia S.A., Lausanne, CH Bd. A53, Nr. 1/3, (May 1, 1996), 325-328*.
Pannek Thorsten
Trah Hans-Peter
Gutierrez Diego
Jagan Mirellys
Kenyon & Kenyon
Robert & Bosch GmbH
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