Microstructure sealing tool and methods of using the same

Details Microstructure sealing tool and methods of using the same Microstructure sealing tool and methods of using the same

2007-01-11

2010-02-02

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S026000, C438S028000, C438S613000, C228S180220, C257SE21509, C257SE33056

Reexamination Certificate

active

07655553

ABSTRACT:
A method of packing electronic devices and an apparatus thereof are disclosed herein. The method allows for usage of solder materials with a melting temperature of 180° C. or higher, such as from 210° C. to 300° C., and from 230° C. to 260° C., so as to provide reliable and robust packaging. This method is particularly useful for packaging electronic devices that are sensitive to temperatures, such as microstructures, which can be microelectromechanical devices (MEMS), such as micromirror array devices.

REFERENCES:
patent: 7282432 (2007-10-01), Tago et al.
patent: 7341880 (2008-03-01), Erchak et al.
patent: 7348193 (2008-03-01), Ouyang
patent: 7528061 (2009-05-01), Syllaios et al.
patent: 2005/0079644 (2005-04-01), Sakurada
patent: 2005/0274969 (2005-12-01), Suzuki

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