Micropattern shape measuring system and method

Details Micropattern shape measuring system and method Micropattern shape measuring system and method

2005-05-17

2005-05-17

Smith, Zandra (Department: 2877)

Optics: measuring and testing

Dimension

Width or diameter

C356S337000, C250S310000

Reexamination Certificate

active

06894790

ABSTRACT:
A test pattern formed in a scribe line area of a wafer is irradiated with a light beam to measure the width thereof; the test pattern is irradiated with an electron beam so as to measure the width thereof; an amount of change in the width of the test pattern is calculated; a dummy pattern having the same width as that of a semiconductor device of the wafer is irradiated with an electron beam to measure the width thereof; and the width of a pattern is estimated by the use of the calculated amount of width change so as to determine the shape of the pattern. Thus, a shape measuring system and method capable of determining the shape of a micropattern in a semiconductor device without changing the dimensions of the micropattern can be provided.

REFERENCES:
patent: 5422723 (1995-06-01), Paranjpe et al.
patent: 5585211 (1996-12-01), Firstein et al.
patent: 5607800 (1997-03-01), Ziger
patent: 6407373 (2002-06-01), Dotan
patent: 6650424 (2003-11-01), Brill et al.
patent: 4-342942 (1992-11-01), None
patent: 8-255751 (1996-10-01), None

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