4. Semiconductor device manufacturing: process
  5. Making device or circuit responsive to nonelectrical signal
  6. Physical stress responsive

Heiko Stahl

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Micromechanical component having an anodically bonded cap...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Micromechanical diaphragm sensor having a double diaphragm

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate

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Micropump having a pump diaphragm and a polysilicon layer

Pumps – Motor driven – Electric or magnetic motor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2324157

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