Micromechanical component and suitable method for its...

Details Micromechanical component and suitable method for its... Micromechanical component and suitable method for its...

2005-09-07

2008-10-14

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

By reaction with substrate

C438S637000, C438S680000, C257SE21170, C257SE21222, C257SE21132, C257SE21249, C257SE21278

Reexamination Certificate

active

07435691

ABSTRACT:
A micromechanical component having a silicon substrate; a cavity provided in the substrate; and a diaphragm, provided on the surface of the substrate, which closes the cavity; the diaphragm featuring a silicon-oxide layer having an opening that is formed by silicon-oxide wedges pointing to each other; and the diaphragm having at least one closing layer which closes the opening. Also, a suitable manufacturing method.

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patent: 5393692 (1995-02-01), Wu
patent: 5399520 (1995-03-01), Jang
patent: 5789305 (1998-08-01), Peidous
patent: 5994203 (1999-11-01), Mathews
patent: 6245643 (2001-06-01), King et al.

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