Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface
Patent
1992-12-21
1994-07-19
Chea, Thorl
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Forming nonplanar surface
430273, 430325, 430313, 430327, G03C 1495, G03C 1727
Patent
active
053308816
ABSTRACT:
A microlithographic resist patterning process which allows generation of very thick, vertically-walled resist patterns which allow for subsequent deposition or etching operations can produce high recording density magnetic thin film heads and other devices requiring high aspect ratios.
REFERENCES:
patent: 4315985 (1982-02-01), Catellani et al.
patent: 4539616 (1985-09-01), Yuito et al.
patent: 4663275 (1987-05-01), West et al.
patent: 4869999 (1989-09-01), Fukuda et al.
General Electric Microelectronic Materials, User Guidelines, CEM BC5, Apr. 22, 1985.
General Electric Microelectronic Materials, User Guidelines, CEM 388, date unknown.
Chemical and Engineering News, p. 25, May 28, 1984.
Bernard, "Simulation of Focus Effects in Photolithography", IEEE Transactions on Semiconductor Manufacturing, vol. 1, No. 3, Aug. 1988, pp. 85-97.
Etrillard et al., "Metal lift-off using a trilevel resist system for electron beam lithography", Microelectronic Engineering, vol. 7, No. 1, 1987, pp. 11-20.
Lee et al., "Fabrication of Semiconductor CMOS Circuits Using a New Trilayer Photolithographic Process", IEEE Electron Device Letters, EDL-8, No. 9, Sep. 1987, pp. 404-406.
"Fine-Line Pattern Processing for Photoresist Films", NTIS Technical Notes, No. 11, Part c, Nov. 1984, p. 855.
Meyerhofer, "Modelling of Microlithographic Processes: Comparison of Contrast Enhancement Techniques", Journal of Imaging Science, vol. 30, No. 4, Jul./Aug. 1986, pp. 155-159.
Wilkinson, "Weitere Verkleinerung der Halbleiterstrukturen durch Elektronenstrahllithographie", Laser & Optoelektronik, vol. 19, No. 1, Mar. 1987, pp. 55-56.
Fung Susan K.
Sidman Alan L.
Chea Thorl
Digital Equipment Corp.
LandOfFree
Microlithographic method for producing thick, vertically-walled does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microlithographic method for producing thick, vertically-walled , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microlithographic method for producing thick, vertically-walled will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-519314