Microelectronics package assembly tool and method of...

Details Microelectronics package assembly tool and method of... Microelectronics package assembly tool and method of...

2006-08-29

2006-08-29

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S124000, C438S126000, C438S125000

Reexamination Certificate

active

07098082

ABSTRACT:
A method of manufacturing a microelectronic package comprising, in one embodiment, providing a package substrate, coupling a device substrate to the package substrate, and assembling a bifurcated mold around the device and package substrates, the bifurcated mold including a seal. The method also includes encapsulating the device and package substrates employing the bifurcated mold.

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