Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2006-10-17
2006-10-17
Andujar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C029S840000, C029S855000, C361S743000
Reexamination Certificate
active
07122905
ABSTRACT:
Packaged microelectronic devices, methods of manufacturing packaged microelectronic devices, and method of mounting packaged microelectronic devices to printed circuit boards. One embodiment can include a die, an interposer substrate, a solder-ball, and a dielectric compound. The die can have an integrated circuit and at least one bond-pad coupled to the integrated circuit. The interposer substrate is coupled to the die and can have at least one ball-pad electrically coupled to the bond-pad on the die. The interposer substrate can also have a trace line adjacent to the ball-pad, and a solder-mask having an opening over the ball-pad. The solder-ball can contact the ball-pad in the opening. The dielectric compound can insulate the ball-pad and the solder-ball from an exposed portion of the adjacent trace line in the opening.
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Andujar Leonardo
Micro)n Technology, Inc.
Perkins Coie LLP
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