Microelectronic connection components having bondable wires

Details Microelectronic connection components having bondable wires Microelectronic connection components having bondable wires

2007-09-11

2007-09-11

Norris, Jeremy C. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C257S784000, C257S734000, C029S854000, C029S857000, C029S860000

Reexamination Certificate

active

11111145

ABSTRACT:
A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be formed, in one embodiment, by stitch bonding wire leads across the gap. In another embodiment, a prefabricated lead assembly supporting spaced apart parallel leads is juxtaposed and transferred to the substrate. The connection component is juxtaposed overlying a semiconductor chip whereby leads extending over the gap may have one end detached and bonded to an underlying chip contact.

REFERENCES:
patent: 5446245 (1995-08-01), Iwayama et al.
patent: 5489749 (1996-02-01), DiStefano et al.
patent: 5719435 (1998-02-01), Davis et al.
patent: 5977618 (1999-11-01), DiStefano et al.
patent: 6229100 (2001-05-01), Fjelstad
patent: 6307253 (2001-10-01), Yamamoto et al.
patent: 2005/0083153 (2005-04-01), Qin et al.

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