4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Multiple housings

Philip R. Osborn

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Microelectronic assembly with joined bond elements having...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Microelectronic connection components having bondable wires

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Microelectronic packages having cavities for receiving...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Philip R. Osborn does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Philip R. Osborn, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Philip R. Osborn will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-2176034

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure