Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1996-06-03
1999-04-20
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257704, 257701, 438108, H01L 2348
Patent
active
058959769
ABSTRACT:
A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24) and a face (27) facing away from the substrate (14). A polymeric reinforcement (18) is disposed onto the die face (27) to protect the die (12) and to reduce the effects of thermally induced stresses on the die (12) and the solder bump interconnections (32). The polymeric reinforcement (18) is spaced apart from the die perimeter (24) to maintain a desired peripheral fillet geometry of the encapsulant (16).
REFERENCES:
patent: 4843036 (1989-06-01), Schmidt et al.
patent: 4942140 (1990-07-01), Ootsuki et al.
patent: 5089440 (1992-02-01), Christie et al.
patent: 5120678 (1992-06-01), Moore et al.
patent: 5121190 (1992-06-01), Hsiao et al.
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5136366 (1992-08-01), Worp et al.
patent: 5218234 (1993-06-01), Thompson et al.
patent: 5218759 (1993-06-01), Juskey et al.
patent: 5220489 (1993-06-01), Barreto et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5249101 (1993-09-01), Frey et al.
patent: 5274913 (1994-01-01), Grebe et al.
patent: 5278726 (1994-01-01), Bernardoni et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5290197 (1994-03-01), Ohnuma et al.
patent: 5317195 (1994-05-01), Ishikawa
patent: 5355580 (1994-10-01), Tsukada
patent: 5423119 (1995-06-01), Yang
patent: 5460767 (1995-10-01), Sanftleben et al.
patent: 5471027 (1995-11-01), Call et al.
patent: 5568684 (1996-10-01), Wong
patent: 5583370 (1996-12-01), Higgins, III et al.
patent: 5656857 (1997-08-01), Kishita
patent: 5659203 (1997-08-01), Call et al.
patent: 5684325 (1997-11-01), Kataoka et al.
Carson George A.
Machuga Steven C.
Morrell Michelle J.
O'Malley Grace M.
Skipor Andrew
Chaudhuri Olik
Fekete Douglas D.
Kelley Nathan K.
MacIntyre John
Motorola Corporation
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